EXSHINE Part Number: | EX-MFP 1/8" CR 48" BX |
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Manufacturer Part Number: | MFP 1/8" CR 48" BX |
Manufacturer / Brand: | 3M |
Brief Description: | HEATSHRINK MFP 1/8"X4' CLEAR |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | MFP Series DatasheetHeat Shrink Tubing and Devices Catalog |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Type | Tubing, Semi Rigid |
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Shrinkage Ratio | 2 to 1 |
Shrink Temperature | - |
Series | MFP |
Recovered Wall Thickness | 0.010" (0.25mm) |
Other Names | 051135-36889 51128597422 5113536889 51135368893 80-6107-8790-7 80610787907 80611600034 KY018C KY018C-100 KYNAR 1/8" CR 48" KYNAR 1/8"CR48"BX MFP18CR48BX |
Operating Temperature | -55°C ~ 175°C |
Material | Polyvinylidene Fluoride (PVDF), Irradiated |
Manufacturer Standard Lead Time | 3 Weeks |
Manufacturer Part Number | MFP 1/8" CR 48" BX |
Length | 4.00' (1.22m) |
Inner Diameter - Supplied | 0.125" (3.18mm) |
Inner Diameter - Recovered | 0.062" (1.57mm) |
Features | Abrasion and Cut Resistant, Chemical Resistant, Flame Retardant, Fuel Resistant, Solvent Resistant |
Expanded Description | Heat Shrink Tubing, Semi Rigid 0.125" (3.18mm) 2 to 1 Clear 4.00' (1.22m) |
Description | HEATSHRINK MFP 1/8"X4' CLEAR |
Color | Clear |
Standard Package | 1 |
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Other Names | 051135-36889 51128597422 5113536889 51135368893 80-6107-8790-7 80610787907 80611600034 KY018C KY018C-100 KYNAR 1/8" CR 48" KYNAR 1/8"CR48"BX MFP18CR48BX |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.