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EXSHINE Part Number: | EX-MH14-14FLK |
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Manufacturer Part Number: | MH14-14FLK |
Manufacturer / Brand: | 3M |
Brief Description: | CONN SPADE TERM 14-16AWG #1/4 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | MH18-6FL thru MH10-14FL DatasheetWire Terminals Catalog |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Wire Gauge | 14-16 AWG |
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Width - Outer Edges | 0.430" (10.92mm) |
Tongue Inside Opening | - |
Termination | Crimp |
Terminal Type | Spring, Snap |
Stud/Tab Size | 1/4 Stud |
Series | Scotchlok™ |
Packaging | Bulk |
Other Names | 00054007063339 054007-06333 05400706333 5400706333 54007063339 80-6105-3016-6 80610530166 920024-33 MH14-14FLK (BULK) |
Mounting Type | Free Hanging (In-Line) |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polyolefin |
Manufacturer Standard Lead Time | 5 Weeks |
Manufacturer Part Number | MH14-14FLK |
Length - Termination | 0.610" (15.49mm) |
Length - Ring Center to Termination | 0.270" (6.86mm) |
Length - Overall | 1.100" (27.94mm) |
Insulation Diameter | - |
Insulation | Insulated with Heat Shrink |
Features | Brazed Seam |
Expanded Description | Blue 1/4 Stud Spade Terminal Connector Crimp 14-16 AWG |
Description | CONN SPADE TERM 14-16AWG #1/4 |
Contact Material | Copper, ETP |
Contact Finish | Tin |
Color | Blue |
Other Names | 00054007063339 054007-06333 05400706333 5400706333 54007063339 80-6105-3016-6 80610530166 920024-33 MH14-14FLK (BULK) |
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Standard Package | 250 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.