MH18-10FLK

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MH18-10FLK

EXSHINE Part Number:EX-MH18-10FLK
Manufacturer Part Number:MH18-10FLK
Manufacturer / Brand:3M
Brief Description:CONN SPADE TERM 18-22AWG #10 RED
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:MH18-6FL thru MH10-14FL Datasheet
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
MH18-10FLK
In stock: 85586000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order MH18-10FLK online

US$ 0.625

Reference Marketing Price: US$ 0.625

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

250+:
$0.625
  • Description
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Product Parameter

Wire Gauge 18-22 AWG
Width - Outer Edges 0.320" (8.13mm)
Tongue Inside Opening -
Termination Crimp
Terminal Type Spring, Snap
Stud/Tab Size 10 Stud
Series Scotchlok™
Packaging Bulk
Other Names 00054007063537
054007-06353
05400706353
5400706353
54007063537
80-6105-3036-4
80610530364
920024-29
MH18-10FLK (BULK)
Mounting Type Free Hanging (In-Line)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material - Insulation Polyolefin
Manufacturer Standard Lead Time 5 Weeks
Manufacturer Part Number MH18-10FLK
Length - Termination 0.610" (15.49mm)
Length - Ring Center to Termination 0.150" (3.81mm)
Length - Overall 1.000" (25.40mm)
Insulation Diameter -
Insulation Insulated with Heat Shrink
Features Brazed Seam
Expanded Description Red 10 Stud Spade Terminal Connector Crimp 18-22 AWG
Description CONN SPADE TERM 18-22AWG #10 RED
Contact Material Copper, ETP
Contact Finish Tin
Color Red

Others

Other Names 00054007063537

054007-06353

05400706353

5400706353

54007063537

80-6105-3036-4

80610530364

920024-29

MH18-10FLK (BULK)
Standard Package 250

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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