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MNG10-610RK
| EXSHINE Part Number: | EX-MNG10-610RK |
|---|---|
| Manufacturer Part Number: | MNG10-610RK |
| Manufacturer / Brand: | 3M |
| Brief Description: | CONN RING MULT STUD 10-12AWG |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | MNG1x-610RX |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
In stock: 99604 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Wire Gauge | 10-12 AWG |
|---|---|
| Width - Outer Edges | 0.390" (9.91mm) |
| Thickness | 0.040" (1.02mm) |
| Termination | Crimp |
| Terminal Type | Multi-Stud |
| Stud/Tab Size | 6, 8, 10 Stud |
| Series | Scotchlok™ |
| Packaging | Bulk |
| Other Names | 00054007021001 05400702100 80610051007 |
| Mounting Type | Free Hanging (In-Line) |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Material - Insulation | Polyamide (PA), Nylon |
| Manufacturer Part Number | MNG10-610RK |
| Length - Overall | 1.190" (30.23mm) |
| Insulation Diameter | 0.250" (6.35mm) |
| Insulation | Insulated |
| Features | - |
| Expanded Description | Ring Terminal Connector 6, 8, 10 Stud Multi-Stud 10-12 AWG Crimp |
| Description | CONN RING MULT STUD 10-12AWG |
| Contact Material | Copper, ETP |
| Contact Finish | Tin |
| Color | Yellow |
Others
| Other Names | 00054007021001 05400702100 80610051007 |
|---|---|
| Standard Package | 500 |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of 3M
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.