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MU18BCX

EXSHINE Part Number:EX-MU18BCX
Manufacturer Part Number:MU18BCX
Manufacturer / Brand:3M
Brief Description:CONN SPLICE 18-22 AWG CRIMP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:MU18BCX
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
MU18BCX
In stock: 38757000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order MU18BCX online

US$ 0.692

Reference Marketing Price: US$ 0.692

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

100+:
$0.692
  • Description
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Product Parameter

Wire Gauge 18-22 AWG
Termination Crimp
Terminal Type Butt Splice, Inline, Individual Openings
Series Scotchlok™
Packaging Bulk
Other Names 00051128590065
05112859006
80611466527
Number of Wire Entries 2
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number MU18BCX
Insulation Non-Insulated
Features -
Expanded Description Terminal Butt Splice, Inline, Individual Openings Connector Crimp 18-22 AWG
Description CONN SPLICE 18-22 AWG CRIMP
Color -

Others

Other Names 00051128590065

05112859006

80611466527
Standard Package 100

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

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 Western Union
 Receiving: 1-2 hours.

 MoneyGram
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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