EXSHINE Part Number: | EX-MVU10-10FFBK |
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Manufacturer Part Number: | MVU10-10FFBK |
Manufacturer / Brand: | 3M |
Brief Description: | CONN SPADE TERM 10-12AWG #10 YEL |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | MVU18-6FFB thru MVU10-10FFB |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Wire Gauge | 10-12 AWG |
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Width - Outer Edges | 0.320" (8.13mm) |
Tongue Inside Opening | - |
Termination | Crimp |
Terminal Type | Flanged |
Stud/Tab Size | 10 Stud |
Series | Scotchlok™ |
Packaging | Bulk |
Other Names | 00054007020400 054007-02040 05400702040 5400702040 54007020400 80-6100-5029-8 80610050298 920022-22 MVU10-10FFBK (BULK) MVU1010FFBK |
Mounting Type | Free Hanging (In-Line) |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Vinyl |
Manufacturer Standard Lead Time | 3 Weeks |
Manufacturer Part Number | MVU10-10FFBK |
Length - Termination | 0.550" (13.97mm) |
Length - Ring Center to Termination | 0.290" (7.37mm) |
Length - Overall | 1.030" (26.16mm) |
Insulation Diameter | 0.250" (6.35mm) |
Insulation | Insulated |
Features | Butted Seam |
Expanded Description | Yellow 10 Stud Spade Terminal Connector Crimp 10-12 AWG |
Description | CONN SPADE TERM 10-12AWG #10 YEL |
Contact Material | Copper, ETP |
Contact Finish | Tin |
Color | Yellow |
Standard Package | 500 |
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Other Names | 00054007020400 054007-02040 05400702040 5400702040 54007020400 80-6100-5029-8 80610050298 920022-22 MVU10-10FFBK (BULK) MVU1010FFBK |
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.