RF3750

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RF3750

EXSHINE Part Number:EX-RF3750
Manufacturer Part Number:RF3750
Manufacturer / Brand:3M
Brief Description:SCOTCH(TM) BUNDLING WRAP RF3750,
Lead Free Status / RoHS Status:Not applicable / Not applicable
Condition:New and unused, Original
Datasheet Download:Scotch™ Fasteners Brochure
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
RF3750
In stock: 39230 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order RF3750 online

US$ 17.6

Reference Marketing Price: US$ 17.6

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$17.60
10+:
$16.345
50+:
$14.249
100+:
$12.573
250+:
$11.735
500+:
$11.483
1000+:
$10.897
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Series Scotch™
Packaging Package Card
Other Names 00051141380568
3M156109
70006911575
Manufacturer Part Number RF3750
Kit Type Cable Ties
Kit Contents 30' (9.14m) Reel of Strapping, Black
Expanded Description Cable Ties Circuit Protection Kit 30' (9.14m) Reel of Strapping, Black
Description SCOTCH(TM) BUNDLING WRAP RF3750,

Others

Other Names 00051141380568

3M156109

70006911575
Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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