EXSHINE Part Number: | EX-SPD08-200-L-RB |
---|---|
Manufacturer Part Number: | SPD08-200-L-RB |
Manufacturer / Brand: | 3M |
Brief Description: | CONN EDGE DUAL FMALE 200POS .031 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | SPD08 Series DrawingSPD08 BriefSPD08 Series Overview |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Termination | Solder |
---|---|
Series | SPD08 |
Read Out | Dual |
Pitch | 0.031" (0.80mm) |
Packaging | Tray |
Other Names | 00076308602659 07630860265 3M12044 3M12044CT 3M12044CT-ND SPC08-200-L-RB-TR SPD08200LRB XF003826898 |
Operating Temperature | -55°C ~ 125°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | - |
Number of Positions | 200 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Liquid Crystal Polymer (LCP), Glass Filled |
Manufacturer Standard Lead Time | 3 Weeks |
Manufacturer Part Number | SPD08-200-L-RB |
Gender | Female |
Flange Feature | - |
Features | Board Guide, Latches |
Description | CONN EDGE DUAL FMALE 200POS .031 |
Contact Type | Cantilever |
Contact Material | Copper Alloy |
Contact Finish Thickness | 30µin (0.76µm) |
Contact Finish | Gold |
Color | Black |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.062" (1.57mm) |
Other Names | 00076308602659 07630860265 3M12044 3M12044CT 3M12044CT-ND SPC08-200-L-RB-TR SPD08200LRB XF003826898 |
---|---|
Standard Package | 300 |
|
T/T (Bank Transfer) Receiving: 1-4 days. |
|
Paypal Receiving: immediately. |
|
Western Union Receiving: 1-2 hours. |
|
MoneyGram Receiving: 1-2 hours. |
|
Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
|
FEDEX EXPRESS Delivery time: 1-3 days. |
|
UPS EXPRESS Delivery time: 2-4 days. |
|
TNT EXPRESS Delivery time: 3-6 days. |
|
EMS EXPRESS Delivery time: 7-10 days. |
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.