UR2-25/PACK

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UR2-25/PACK

EXSHINE Part Number:EX-UR2-25/PACK
Manufacturer Part Number:UR2-25/PACK
Manufacturer / Brand:3M
Brief Description:CONN SPLICE 19-26 AWG IDC 25PC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:UR2, UY2, UB2A BrochureSolutions For Outside Plant Catalog
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
UR2-25/PACK
In stock: 32790 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order UR2-25/PACK online

US$ 0

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Product Parameter

Wire Gauge 19-26 AWG
Termination IDC
Terminal Type Butt Splice, Closed End, Individual Openings
Series Scotchlok™
Packaging Bulk
Other Names 05111526117
5111522985
51115229855
5111526117
51115261176
80611323629
80611326754
UR2-PK25
UR2-PK25-ND
UR225/PACK
Number of Wire Entries Varies by Wire Size
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number UR2-25/PACK
Insulation Fully Insulated
Features Gel Filled
Expanded Description Terminal Butt Splice, Closed End, Individual Openings Connector IDC 19-26 AWG Red
Description CONN SPLICE 19-26 AWG IDC 25PC
Color Red

Others

Standard Package 40
Other Names 05111526117

5111522985

51115229855

5111526117

51115261176

80611323629

80611326754

UR2-PK25

UR2-PK25-ND

UR225/PACK

You can choose the below payment options. Please contact our sales team if you have any questions.

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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of 3M

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.
3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com.
3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

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