AF8GUD3A-OEM

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AF8GUD3A-OEM

EXSHINE Part Number:EX-AF8GUD3A-OEM
Manufacturer Part Number:AF8GUD3A-OEM
Manufacturer / Brand:ATP Electronics, Inc.
Brief Description:MEM CARD MICROSD 8GB CLS10 AMLC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:AFxGSD3A, AFxGUD3A Datasheet
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
AF8GUD3A-OEM
In stock: 76480 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order AF8GUD3A-OEM online

US$ 26.27

Reference Marketing Price: US$ 26.27

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$26.27
10+:
$24.695
25+:
$23.846
50+:
$23.089
100+:
$20.316
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Technology aMLC
Speed Class 10
Series -
Operating Temperature -25°C ~ 85°C
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Memory Type microSD™
Memory Size 8GB
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number AF8GUD3A-OEM
Expanded Description Memory Card microSD™ 8GB Class 10 aMLC
Description MEM CARD MICROSD 8GB CLS10 AMLC

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of ATP Electronics, Inc.

- ATP strives to provide advanced, highest capacity, value-added memory products and solutions by its innovation in IC packaging and module/flash media product design technology to best service its customer base through its global sales and marketing channels.

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