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AW24M64F8BLK0MW
| EXSHINE Part Number: | EX-AW24M64F8BLK0MW |
|---|---|
| Manufacturer Part Number: | AW24M64F8BLK0MW |
| Manufacturer / Brand: | ATP Electronics, Inc. |
| Brief Description: | MODULE DDR3 SDRAM 8GB 204SODIMM |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | AW24M64F8BLK0MW |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
AW24M64F8BLK0MW
In stock: 8023 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 8023 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Speed | 1600MT/s |
|---|---|
| Series | - |
| Package / Case | 204-SODIMM |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Memory Type | DDR3 SDRAM |
| Memory Size | 8GB |
| Manufacturer Standard Lead Time | 8 Weeks |
| Manufacturer Part Number | AW24M64F8BLK0MW |
| Expanded Description | Memory Module DDR3 SDRAM 8GB 1600MT/s 204-SODIMM |
| Description | MODULE DDR3 SDRAM 8GB 204SODIMM |
Others
| Standard Package | 10 |
|---|
You can choose the below payment options. Please contact our sales team if you have any questions.
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T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of ATP Electronics, Inc.
- ATP strives to provide advanced, highest capacity, value-added memory products and solutions by its innovation in IC packaging and module/flash media product design technology to best service its customer base through its global sales and marketing channels.