573300D00010G

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573300D00010G

EXSHINE Part Number:EX-573300D00010G
Manufacturer Part Number:573300D00010G
Manufacturer / Brand:Aavid Thermalloy
Brief Description:HEATSINK D2PAK .4" HIGH SMD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Standard Heatsinks Catalog
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
573300D00010G
In stock: 64706000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 573300D00010G online

US$ 0.87

Reference Marketing Price: US$ 0.87

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$0.87
10+:
$0.833
25+:
$0.791
50+:
$0.77
100+:
$0.76
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Width 1.030" (26.16mm)
Type Top Mount
Thermal Resistance @ Natural 18°C/W
Thermal Resistance @ Forced Air Flow 10.0°C/W @ 200 LFM
Shape Rectangular
Series -
Power Dissipation @ Temperature Rise 1.25W @ 30°C
Package Cooled TO-263 (D²Pak)
Other Names HS338CT
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Finish Tin
Material Copper
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number 573300D00010G
Length 0.500" (12.70mm)
Height Off Base (Height of Fin) 0.400" (10.16mm)
Expanded Description Heat Sink TO-263 (D²Pak) Copper 1.25W @ 30°C Top Mount
Diameter -
Description HEATSINK D2PAK .4" HIGH SMD
Attachment Method SMD Pad

Others

Standard Package 1
Other Names HS338CT

You can choose the below payment options. Please contact our sales team if you have any questions.

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Aavid Thermalloy

- Aavid Thermalloy is a premier provider of thermal solutions and products to the world’s leading electronics companies in the USA, Europe and Asia. Since 1964, Aavid Engineers have been solving thermal challenges and designing products for leading companies worldwide such as Cisco, Juniper Networks, Apple, Microsoft, Intel, HP, Sun Microsystems, Mitsubishi, Panasonic, Dell, IBM, Lockheed-Martin, GE, Samsung, and many more.

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