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0783210001

EXSHINE Part Number:EX-0783210001
Manufacturer Part Number:0783210001
Manufacturer / Brand:Affinity Medical Technologies - a Molex company
Brief Description:CONN SKT DIMM 240POS PCB
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:783210001 Drawing
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
0783210001
In stock: 26230 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 0783210001 online

US$ 5.237

Reference Marketing Price: US$ 5.237

Our Best Price: N/A (Email us)

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Multiples:1

2400+:
$5.237
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Product Parameter

Standards MO-269
Series 78321
Packaging Tray
Other Names 0783-21-0001
783-21-0001
78321-0001
783210001
Number of Positions 240
Mounting Type Through Hole
Mounting Feature Normal, Standard - Top
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Memory Type DDR3 SDRAM
Manufacturer Standard Lead Time 12 Weeks
Manufacturer Part Number 0783210001
Features Board Lock, Latches
Expanded Description 240 Position DIMM DDR3 SDRAM Socket Through Hole
Description CONN SKT DIMM 240POS PCB
Contact Finish Thickness 15µin (0.38µm)
Contact Finish Gold
Connector Style DIMM

Others

Other Names 0783-21-0001

783-21-0001

78321-0001

783210001
Standard Package 2,400

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Distributor of Molex, LLC

- As a leading global supplier of electronic interconnects, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life. Our portfolio is among the world’s largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling.
Molex serves customers in a variety of industries, including the telecom, datacom, computer / peripheral, automotive, premise wiring, industrial, consumer, medical and military markets. And because we have the highest levels of R&D investment in our industry, Molex is known for providing a continuous flow of innovation in areas such as high-speed signal integrity, miniaturization, higher power delivery, optical signal transmission and sealed harsh-environment connectivity.
For over 70 years, our focus has been on providing advanced products that meet tomorrow’s needs, today.

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