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16-675-190T

EXSHINE Part Number:EX-16-675-190T
Manufacturer Part Number:16-675-190T
Manufacturer / Brand:Aries Electronics, Inc.
Brief Description:675 DIP PROGRAM HEADER
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:675 Series Dip Program Headers
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
16-675-190T
In stock: 67240 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 16-675-190T online

US$ 1.665

Reference Marketing Price: US$ 1.665

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$1.665
  • Description
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Product Parameter

Termination Solder
Series 675
Row Spacing 0.300" (7.62mm)
Pitch 0.100" (2.54mm)
Packaging Bulk
Number of Rows 2
Number of Positions 16
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number 16-675-190T
Features Programmable
Expanded Description 16 Position Header Connector Male Pin Tin
Description 675 DIP PROGRAM HEADER
Contact Type Male Pin
Contact Finish Thickness 200µin (5.08µm)
Contact Finish Tin
Connector Type Header
Color Black

Others

Standard Package 23

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Aries Electronics

- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.

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