Photo for reference only Contact us for more images
EXSHINE Part Number: | EX-28-650000-10-P |
---|---|
Manufacturer Part Number: | 28-650000-10-P |
Manufacturer / Brand: | Aries Electronics, Inc. |
Brief Description: | SOCKET ADAPTER SOIC TO 28DIP 0.6 |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
Condition: | New and unused, Original |
Datasheet Download: | 450001,650000 Series |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Termination Post Length | 0.125" (3.18mm) |
---|---|
Termination | Solder |
Series | Correct-A-Chip® 650000 |
Pitch - Post | 0.100" (2.54mm) |
Pitch - Mating | 0.050" (1.27mm) |
Other Names | 362A1669P2 Q2830605 |
Operating Temperature | - |
Number of Pins | 28 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Flammability Rating | - |
Manufacturer Standard Lead Time | 3 Weeks |
Manufacturer Part Number | 28-650000-10-P |
Housing Material | - |
Features | - |
Expanded Description | IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole |
Description | SOCKET ADAPTER SOIC TO 28DIP 0.6 |
Current Rating | - |
Convert To (Adapter End) | DIP, 0.6" (15.24mm) Row Spacing |
Convert From (Adapter End) | SOIC |
Contact Material - Post | Brass |
Contact Material - Mating | - |
Contact Finish Thickness - Post | - |
Contact Finish Thickness - Mating | - |
Contact Finish - Post | Tin-Lead |
Contact Finish - Mating | - |
Board Material | FR4 Epoxy Glass |
Other Names | 362A1669P2 Q2830605 |
---|---|
Standard Package | 84 |
|
T/T (Bank Transfer) Receiving: 1-4 days. |
|
Paypal Receiving: immediately. |
|
Western Union Receiving: 1-2 hours. |
|
MoneyGram Receiving: 1-2 hours. |
|
Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
|
FEDEX EXPRESS Delivery time: 1-3 days. |
|
UPS EXPRESS Delivery time: 2-4 days. |
|
TNT EXPRESS Delivery time: 3-6 days. |
|
EMS EXPRESS Delivery time: 7-10 days. |
- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.