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96-100M65

EXSHINE Part Number:EX-96-100M65
Manufacturer Part Number:96-100M65
Manufacturer / Brand:Aries Electronics, Inc.
Brief Description:SOCKET ADAPTER QFP TO 100PGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:96-100M65
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
96-100M65
In stock: 40776 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Termination Post Length 0.125" (3.18mm)
Termination Solder
Series -
Pitch - Post 0.100" (2.54mm)
Pitch - Mating 0.026" (0.65mm)
Other Names A175
Operating Temperature -
Number of Pins 100
Mounting Type Through Hole
Material Flammability Rating -
Manufacturer Part Number 96-100M65
Housing Material -
Features -
Expanded Description IC Socket Adapter QFP To PGA Through Hole
Description SOCKET ADAPTER QFP TO 100PGA
Current Rating -
Convert To (Adapter End) PGA
Convert From (Adapter End) QFP
Contact Material - Post Brass
Contact Material - Mating Copper
Contact Finish Thickness - Post 200µin (5.08µm)
Contact Finish Thickness - Mating -
Contact Finish - Post Tin-Lead
Contact Finish - Mating Tin
Board Material FR4 Epoxy Glass

Others

Other Names A175
Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

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 Western Union
 Receiving: 1-2 hours.

 MoneyGram
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Aries Electronics

- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.

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