HCPL-J454

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HCPL-J454

EXSHINE Part Number:EX-HCPL-J454
Manufacturer Part Number:HCPL-J454
Manufacturer / Brand:Avago Technologies (Broadcom Limited)
Brief Description:OPTOISO 3.75KV TRANSISTOR 8DIP
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:1
Datasheet Download:HCPL-4504/J454/0454, HCNW4504
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HCPL-J454
In stock: 83880 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HCPL-J454 online

US$ 2.347

Reference Marketing Price: US$ 2.347

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1450+:
$2.347
  • Description
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Product Parameter

Voltage - Output (Max) 20V
Voltage - Isolation 3750Vrms
Voltage - Forward (Vf) (Typ) 1.59V
Vce Saturation (Max) -
Turn On / Turn Off Time (Typ) 500ns, 800ns
Supplier Device Package 8-DIP
Series -
Rise / Fall Time (Typ) -
Packaging Tube
Package / Case 8-DIP (0.300", 7.62mm)
Output Type Transistor
Operating Temperature -55°C ~ 100°C
Number of Channels 1
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 8 Weeks
Manufacturer Part Number HCPL-J454
Input Type DC
Expanded Description Optoisolator Transistor Output 3750Vrms 1 Channel 8-DIP
Description OPTOISO 3.75KV TRANSISTOR 8DIP
Current Transfer Ratio (Min) 19% @ 16mA
Current Transfer Ratio (Max) 60% @ 16mA
Current - Output / Channel 8mA
Current - DC Forward (If) (Max) 25mA

Others

Standard Package 50

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Distributor of Broadcom Limited

- Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others. Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.

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