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HCPL824

EXSHINE Part Number:EX-HCPL824
Manufacturer Part Number:HCPL824
Manufacturer / Brand:Avago Technologies (Broadcom Limited)
Brief Description:HCPL824 AVAGO DIP SOP new date code and low price
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:1
Datasheet Download:HCPL824
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HCPL824
In stock: 62300 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HCPL824 online

US$ 0

Reference Marketing Price: N/A

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

  • Description
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Product Parameter

Voltage -
Series HCPL
Package Type DIP SOP
Operating Temperature -
Mounting Type -
Moisture Sensitivity Level (MSL) 1
MFG Part Code HCPL824
Features -
Dimension -
Delivery Time 1 Day
Date Code New

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of AVAGO

- Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others. Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.

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