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HP7560L

EXSHINE Part Number:EX-HP7560L
Manufacturer Part Number:HP7560L
Manufacturer / Brand:Avago Technologies (Broadcom Limited)
Brief Description:Low Price HP7560L AVAGO DIP SOP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:HP7560L
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HP7560L
In stock: 31614 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HP7560L online

US$ 0

Reference Marketing Price: N/A

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

  • Description
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Product Parameter

Voltage -
Standard Packing Quantity -
Series HP75
Package Type DIP SOP
Operating Temperature -
Mounting Type -
Moisture Sensitivity Level (MSL) 1
MFG Part Code HP7560L
Features -
Delivery Time 1 Day
Date Code New

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of AVAGO

- Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others. Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.

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