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L061S105G

EXSHINE Part Number:EX-L061S105G
Manufacturer Part Number:L061S105G
Manufacturer / Brand:BI Technologies / TT Electronics
Brief Description:New Stocks L061S105G bi SMD or Through Hole
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:L061S105G
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
L061S105G
In stock: 84961 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order L061S105G online

US$ 0

Reference Marketing Price: N/A

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

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Product Parameter

Voltage -
Series L061S1
Package Type SMD or Through Hole
Operating Temperature -
Mounting Type -
Moisture Sensitivity Level (MSL) 1
MFG Part Code L061S105G
Features -
Delivery Time 1 Day
Date Code New
Country of Origin -

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

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 Western Union
 Receiving: 1-2 hours.

 MoneyGram
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of bi

BI Technologies, a TT electronics company, designs and manufactures electronic components for customers across defense and aerospace, medical, transportation, energy and industrial electronics markets.
Key application areas are medical, pro-audio and industrial – welding, automation, instrumentation.

Products include: trimming and precision potentiometers, position sensors, turns counting dials, resistor and resistor networks, integrated passive networks, transformers, inductors, hybrid and power hybrid microcircuits, and customer integration of these technologies.

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