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DEX9PA191

EXSHINE Part Number:EX-DEX9PA191
Manufacturer Part Number:DEX9PA191
Manufacturer / Brand:Cannon
Brief Description:D-SUB SOLDER M3 C NUT
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:DEX9PA191
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
DEX9PA191
In stock: 24664 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order DEX9PA191 online

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  • Description
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Product Parameter

Series *
Manufacturer Part Number DEX9PA191
Expanded Description Position Connector,
Description D-SUB SOLDER M3 C NUT

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of ITT Cannon, LLC

- ITT Interconnect Solutions, a division of ITT Corporation, is a world leader in the design and manufacture of highly engineered connector solutions. They operate on a global basis serving customers in the aerospace and defense, medical, oil & gas, transportation and industrial end markets. From the invention of rack-and-panel and D-subminiature to the latest fiber-optic, composite and miniaturized connectors, ITT Interconnect Solutions has been synonymous with innovation, reliability and quality for over 100 years. Today their powerful brands, Cannon, VEAM and BIW Connector Systems deliver solutions that enable the transfer of data, signal, and power in an increasingly connected world.

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