Photo for reference only Contact us for more images
EXSHINE Part Number: | EX-BGA0016-S |
---|---|
Manufacturer Part Number: | BGA0016-S |
Manufacturer / Brand: | Chip Quik, Inc. |
Brief Description: | BGA-25 (0.4MM PITCH) STENCIL |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Condition: | New and unused, Original |
Datasheet Download: | BGA0016-SStencil Selection Guilde |
Application: | - |
Weight: | - |
Alternative Replacement: | - |
Type | BGA |
---|---|
Thickness | 0.0040" (0.102mm) |
Thermal Center Pad | - |
Series | Proto-Advantage |
Pitch | 0.016" (0.40mm) |
Outer Dimension | 0.900" L x 1.300" W (22.86mm x 33.02mm) |
Number of Positions | 25 |
Material | Stainless Steel |
Manufacturer Standard Lead Time | 2 Weeks |
Manufacturer Part Number | BGA0016-S |
Inner Dimension | - |
Description | BGA-25 (0.4MM PITCH) STENCIL |
Standard Package | 1 |
---|
|
T/T (Bank Transfer) Receiving: 1-4 days. |
|
Paypal Receiving: immediately. |
|
Western Union Receiving: 1-2 hours. |
|
MoneyGram Receiving: 1-2 hours. |
|
Alipay Receiving: immediately. |
DHL EXPRESS Delivery time: 1-3 days. |
|
FEDEX EXPRESS Delivery time: 1-3 days. |
|
UPS EXPRESS Delivery time: 2-4 days. |
|
TNT EXPRESS Delivery time: 3-6 days. |
|
EMS EXPRESS Delivery time: 7-10 days. |
- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.
Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.
Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.