110-0002

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110-0002

EXSHINE Part Number:EX-110-0002
Manufacturer Part Number:110-0002
Manufacturer / Brand:Cognimem
Brief Description:IC ASIC CHIP CM1K 1024 NEURONS
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:110-0002
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
110-0002
In stock: 40050 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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  • Description
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Product Parameter

Type Pattern Recognition
Supplier Device Package 100-TQFP (14x14)
Series -
Packaging Tray
Package / Case 100-TQFP
Other Names 1100002
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Manufacturer Part Number 110-0002
Expanded Description Pattern Recognition IC Co-Processing 100-TQFP (14x14)
Description IC ASIC CHIP CM1K 1024 NEURONS
Applications Co-Processing

Others

Standard Package 90
Other Names 1100002

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Distributor of Cognimem

- CogniMem Technologies, Inc. is an innovative semiconductor company specializing in pattern recognition with general purpose hardware based neural networks. Our solutions are tailored to overcome challenges in machine learning, machine vision, robotics, inspection, industrial controls, intelligent security cameras, medical and automotive sensing/ sensor fusion to data mining, video analytics, data searching and more. CogniMem – “Cognitive Memory” – is the world leader in providing practical cognitive computing for intelligent sensing to data mining applications, offering a significant performance/ watt advantage over traditional approaches.
CogniMem™ Technologies is a fabless semi-conductor company designing components for high speed and parallel pattern recognition. Its research and design efforts target two extreme usage models:

  • Embed intelligence into miniature sensory devices without impeding their performance in speed and power consumption.
  • Enable the design of cognitive computing systems in which massive hard-wired parallelism prevails over high power consumption and frequency clocks, just like in the human brain.
These two axes of development will bridge in “TheCloud” connecting devices instrumenting the planet to artificial intelligent systems, thus performing the so-called “global sensing”.

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