CSD20060D

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CSD20060D

EXSHINE Part Number:EX-CSD20060D
Manufacturer Part Number:CSD20060D
Manufacturer / Brand:Cree
Brief Description:DIODE ARRAY SCHOTTKY 600V TO247
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:CSD20060D
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Weight:-
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Real Time Availability for
CSD20060D
In stock: 44437 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Voltage - Forward (Vf) (Max) @ If 1.8V @ 10A
Voltage - DC Reverse (Vr) (Max) 600V
Supplier Device Package TO-247-3
Speed No Recovery Time > 500mA (Io)
Series Zero Recovery™
Reverse Recovery Time (trr) 0ns
Packaging Tube
Package / Case TO-247-3
Operating Temperature - Junction -55°C ~ 175°C
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number CSD20060D
Expanded Description Diode Array 1 Pair Common Cathode Silicon Carbide Schottky 600V 16.5A Through Hole TO-247-3
Diode Type Silicon Carbide Schottky
Diode Configuration 1 Pair Common Cathode
Description DIODE ARRAY SCHOTTKY 600V TO247
Current - Reverse Leakage @ Vr 200µA @ 600V
Current - Average Rectified (Io) (per Diode) 16.5A

Others

Standard Package 600

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Distributor of Cree/Wolfspeed

- Cree leads the LED lighting revolution and is making energy-wasting traditional lighting technologies obsolete through the use of energy-efficient, environmentally friendly LED lighting. Cree first brought the blue LED to market in 1989, and today Cree's XLamp® LEDs have continually exceeded industry standards for brightness and efficiency. Indeed, XLamp LEDs were the first "lighting-class" LEDs – LEDS bright enough to be used in general-illumination applications, such as desk lamps, ceiling fixtures and street lights. In addition, Cree's extensive line of high-brightness LEDs are also introducing new performance levels to outdoor video displays and decorative lighting.
Cree’s power and RF division is now known as Wolfspeed, A Cree Company. Wolfspeed is liberating power and wireless systems from the limitations of silicon by leading the innovation and commercialization of next-generation systems based on silicon carbide and gallium nitride.

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