BCM20732A0KML2G

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BCM20732A0KML2G

EXSHINE Part Number:EX-BCM20732A0KML2G
Manufacturer Part Number:BCM20732A0KML2G
Manufacturer / Brand:Cypress Semiconductor
Brief Description:IOT BLUETOOTH 802.15.4
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:CYW20732A
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
BCM20732A0KML2G
In stock: 78939 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Voltage - Supply 3.8V
Type TxRx + MCU
Series -
Serial Interfaces I²C, SPI, UART
Sensitivity -93dBm
RF Family/Standard Bluetooth
Protocol Bluetooth v4.0
Power - Output 4dBm
Packaging Tray
Package / Case 32-VFQFN Exposed Pad
Other Names CYW20732A0KML2G
CYW20732A0KML2G-ND
Operating Temperature -30°C ~ 85°C
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Modulation GFSK
Memory Size -
Manufacturer Part Number BCM20732A0KML2G
GPIO 14
Frequency 2.4GHz
Expanded Description IC RF TxRx + MCU Bluetooth Bluetooth v4.0 2.4GHz 32-VFQFN Exposed Pad
Description IOT BLUETOOTH 802.15.4
Data Rate (Max) 1Mbps
Current - Transmitting 9.1mA
Current - Receiving 9.8mA

Others

Standard Package 490
Other Names CYW20732A0KML2G

CYW20732A0KML2G-ND

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Distributor of Cypress Semiconductor Corp

- Cypress targets innovative markets growing faster than the overall semiconductor industry, including key segments of the automotive, industrial, home automation and appliances, medical products and consumer electronics businesses. With the help of exshinetech.com Electronics, we supply customers with market-leading solutions based on our MCUs, wireless SoCs, memories, analog ICs and USB controllers. Our world-class wireless technology gives us an unparalleled position in the fast-growing Internet of Things, a business that cuts across our conventional markets and gives us a stake in exciting, next-generation segments such as connected and autonomous cars. Click here to see how we can help you turn your problem today into an idea embedded in tomorrow.

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