FM3164-G

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FM3164-G

EXSHINE Part Number:EX-FM3164-G
Manufacturer Part Number:FM3164-G
Manufacturer / Brand:Cypress Semiconductor
Brief Description:IC MEMORY 14SOIC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:FM31256/3164
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
FM3164-G
In stock: 78070 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order FM3164-G online

US$ 7.53

Reference Marketing Price: US$ 7.53

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$7.53
10+:
$6.932
25+:
$6.788
50+:
$6.764
112+:
$6.068
336+:
$5.884
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Type Processor Companion
Supplier Device Package 14-SOIC
Series -
Packaging Tube
Package / Case 14-SOIC (0.154", 3.90mm Width)
Other Names 428-3220
FM3164G
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Manufacturer Standard Lead Time 10 Weeks
Manufacturer Part Number FM3164-G
Expanded Description Processor Companion IC Processor-Based Systems 14-SOIC
Description IC MEMORY 14SOIC
Applications Processor-Based Systems

Others

Other Names 428-3220

FM3164G
Standard Package 112

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Distributor of Cypress Semiconductor Corp

- Cypress targets innovative markets growing faster than the overall semiconductor industry, including key segments of the automotive, industrial, home automation and appliances, medical products and consumer electronics businesses. With the help of exshinetech.com Electronics, we supply customers with market-leading solutions based on our MCUs, wireless SoCs, memories, analog ICs and USB controllers. Our world-class wireless technology gives us an unparalleled position in the fast-growing Internet of Things, a business that cuts across our conventional markets and gives us a stake in exciting, next-generation segments such as connected and autonomous cars. Click here to see how we can help you turn your problem today into an idea embedded in tomorrow.

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