386827

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386827

EXSHINE Part Number:EX-386827
Manufacturer Part Number:386827
Manufacturer / Brand:Henkel/Loctite
Brief Description:60/40 370 3% .032DIA./21SWG
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Condition:New and unused, Original
Datasheet Download:370(Wrap) DatasheetCored Wire Storage GuidelinesProperties of Solders
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
386827
In stock: 56870 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 386827 online

US$ 34.45

Reference Marketing Price: US$ 34.45

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$34.45
5+:
$33.742
10+:
$30.93
25+:
$25.306
50+:
$23.901
100+:
$22.495
500+:
$19.683
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Wire Gauge 20 AWG, 21 SWG
Weight 1.1 lbs (499g)
Type Wire Solder
Shipping Info -
Shelf Life No Shelf Life
Series 370
Process Leaded
Other Names 82-103
MM00993
Melting Point 361 ~ 374°F (183 ~ 190°C)
Manufacturer Standard Lead Time 11 Weeks
Manufacturer Part Number 386827
Form Spool, 454g (1 lb)
Flux Type Rosin Activated (RA)
Expanded Description Leaded Rosin Activated (RA) Wire Solder Sn60Pb40 (60/40) 20 AWG, 21 SWG Spool, 454g (1 lb)
Diameter 0.032" (0.81mm)
Description 60/40 370 3% .032DIA./21SWG
Core Size 0.033
Composition Sn60Pb40 (60/40)

Others

Other Names 82-103

MM00993
Standard Package 20

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Distributor of Multicore

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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