803261

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803261

EXSHINE Part Number:EX-803261
Manufacturer Part Number:803261
Manufacturer / Brand:Henkel/Loctite
Brief Description:ARRAY LED IMS AVAGO MNSTONE
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:IMS LEDs GuideThermal Clad Selection GuideLED Solutions Guide
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
803261
In stock: 40490 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order 803261 online

US$ 22.75

Reference Marketing Price: US$ 22.75

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$22.75
10+:
$21.41
50+:
$20.072
100+:
$18.734
500+:
$17.396
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Type Thermal Clad Board
Shape Star
Series Thermal Clad® IMS®
Packaging 36 Per Strip; 1 Strip per Pkg
Other Names 803261-ND
BER290
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 6 Weeks
Manufacturer Part Number 803261
For Use With/Related Products Avago Moonstone™ Emitter
Expanded Description Thermal Clad® IMS® Star Avago Moonstone™ Emitter Thermal Clad Board
Description ARRAY LED IMS AVAGO MNSTONE

Others

Standard Package 1
Other Names 803261-ND

BER290

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Bergquist

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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