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BOND PLY 660P 11X12"

EXSHINE Part Number:EX-BOND PLY 660P 11X12"
Manufacturer Part Number:BOND PLY 660P 11X12"
Manufacturer / Brand:Henkel/Loctite
Brief Description:THERMAL TAPE DOUBLE SIDED .008"
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Bond-Ply 660PThermal Clad Selection GuideSil-Pad Selection Guide
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Real Time Availability for
BOND PLY 660P 11X12"
In stock: 84090 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Usage Sheet
Thickness 0.008" (0.203mm)
Thermal Resistivity 0.81°C/W
Thermal Conductivity 0.4 W/m-K
Shape Rectangle
Series Bond-Ply® 660P
Outline 304.80mm x 279.40mm
Other Names Q4936915
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Polyimide
Manufacturer Part Number BOND PLY 660P 11X12"
Expanded Description Thermal Pad Brown 304.80mm x 279.40mm Rectangle Adhesive - Both Sides
Description THERMAL TAPE DOUBLE SIDED .008"
Color Brown
Backing, Carrier Polyimide
Adhesive Adhesive - Both Sides

Others

Other Names Q4936915
Standard Package 1

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Distributor of Bergquist

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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