GF3500S35-00-60-400CC

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GF3500S35-00-60-400CC

EXSHINE Part Number:EX-GF3500S35-00-60-400CC
Manufacturer Part Number:GF3500S35-00-60-400CC
Manufacturer / Brand:Henkel/Loctite
Brief Description:LIQUID GAP FILLER THERMAL CONDUC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:GF3500S35 Datasheet400CC Drawing400CC Kit Guide
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
GF3500S35-00-60-400CC
In stock: 3357 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order GF3500S35-00-60-400CC online

US$ 194.79

Reference Marketing Price: US$ 194.79

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$194.79
10+:
$183.328
50+:
$171.87
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Type Liquid Gap Filler, 2 Part
Size / Dimension 400cc Cartridge
Shipping Info -
Series Gap Filler 3500S35
Other Names BER361
BG420028
GF3500S35-00-60-400CC-ND
Q7014778
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Manufacturer Part Number GF3500S35-00-60-400CC
Expanded Description Thermal Liquid Gap Filler, 2 Part 400cc Cartridge
Description LIQUID GAP FILLER THERMAL CONDUC

Others

Standard Package 1
Other Names BER361

BG420028

GF3500S35-00-60-400CC-ND

Q7014778

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Distributor of Bergquist

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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