Q3-0.005-00-104

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Q3-0.005-00-104

EXSHINE Part Number:EX-Q3-0.005-00-104
Manufacturer Part Number:Q3-0.005-00-104
Manufacturer / Brand:Henkel/Loctite
Brief Description:THERMAL PAD TO-247 .005" Q3
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Q-Pad 3Sil-Pad Selection Guide
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
Q3-0.005-00-104
In stock: 24020000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order Q3-0.005-00-104 online

US$ 0.4

Reference Marketing Price: US$ 0.4

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$0.40
10+:
$0.354
50+:
$0.317
100+:
$0.281
500+:
$0.244
1000+:
$0.183
5000+:
$0.159
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Product Parameter

Usage TO-218, TO-220, TO-247
Thickness 0.0050" (0.127mm)
Thermal Resistivity 0.35°C/W
Thermal Conductivity 2.0 W/m-K
Shape Rectangle
Series Q-Pad® 3
Outline 25.40mm x 19.05mm
Other Names BER131
Q3-104
Q3000500104
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Elastomer
Manufacturer Standard Lead Time 2 Weeks
Manufacturer Part Number Q3-0.005-00-104
Expanded Description Thermal Pad Black 25.40mm x 19.05mm Rectangle
Description THERMAL PAD TO-247 .005" Q3
Color Black
Backing, Carrier Fiberglass
Adhesive -

Others

Standard Package 100
Other Names BER131

Q3-104

Q3000500104

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Distributor of Bergquist

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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