SP2000-0.015-00-104

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SP2000-0.015-00-104

EXSHINE Part Number:EX-SP2000-0.015-00-104
Manufacturer Part Number:SP2000-0.015-00-104
Manufacturer / Brand:Henkel/Loctite
Brief Description:THERMAL PAD TO-220 .015" SP2000
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:Sil-Pad 2000Thermal Clad Selection GuideSil-Pad Selection Guide
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
SP2000-0.015-00-104
In stock: 75161000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order SP2000-0.015-00-104 online

US$ 1.61

Reference Marketing Price: US$ 1.61

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$1.61
10+:
$1.436
50+:
$1.287
100+:
$1.139
500+:
$0.99
1000+:
$0.743
5000+:
$0.644
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Product Parameter

Usage TO-220
Thickness 0.015" (0.381mm)
Thermal Resistivity 0.33°C/W
Thermal Conductivity 3.5 W/m-K
Shape Rectangle
Series Sil-Pad® 2000
Outline 25.40mm x 19.05mm
Other Names 2015-104
2015-104-ND
BER200
BG426900
SP2000001500104
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Silicone Elastomer
Manufacturer Standard Lead Time 2 Weeks
Manufacturer Part Number SP2000-0.015-00-104
Expanded Description Thermal Pad White 25.40mm x 19.05mm Rectangle
Description THERMAL PAD TO-220 .015" SP2000
Color White
Backing, Carrier Fiberglass
Adhesive -

Others

Other Names 2015-104

2015-104-ND

BER200

BG426900

SP2000001500104
Standard Package 100

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Distributor of Bergquist

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

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