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IS27HC010

EXSHINE Part Number:EX-IS27HC010
Manufacturer Part Number:IS27HC010
Manufacturer / Brand:ISSI (Integrated Silicon Solution, Inc.)
Brief Description:131,072 x 8 HIGH-SPEED CMOS EPROM IC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:IS27HC010
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
IS27HC010
In stock: 27406 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order IS27HC010 online

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Product Parameter

Voltage -
Speed -
Series IS27HC
Package Type Original
Operating Temperature -
Mounting Type -
Moisture Sensitivity Level (MSL) 1
MFG Part Code IS27HC010
Features -
Delivery Time 1 Day
Date Code New

You can choose the below payment options. Please contact our sales team if you have any questions.

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 Receiving: 1-4 days.

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 MoneyGram
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of ISSI

- Integrated Silicon Solution, Inc. (ISSI), is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) communications, (iii) digital consumer, and (iv) industrial and medical. Their primary products are high speed and low power SRAM and low and medium density DRAM. The company also designs and markets NOR flash products and high performance analog and mixed signal integrated circuits. They target high-growth markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. They have been a committed long-term supplier of memory products, including lower density and smaller volume products, even through periods of tight manufacturing capacity.

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