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IS61SPD25632T-133T

EXSHINE Part Number:EX-IS61SPD25632T-133T
Manufacturer Part Number:IS61SPD25632T-133T
Manufacturer / Brand:ISSI (Integrated Silicon Solution, Inc.)
Brief Description:IS61SPD25632T-133T QFP Original Package Stock
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:IS61SPD25632T-133T
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
IS61SPD25632T-133T
In stock: 97197 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order IS61SPD25632T-133T online

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Product Parameter

Voltage -
Tolerance -
Series IS61SPD25632
Package Type QFP
Operating Temperature -
Mounting Type -
Moisture Sensitivity Level (MSL) 1
MFG Part Code IS61SPD25632T-133T
Features -
Delivery Time 1 Day
Date Code New

You can choose the below payment options. Please contact our sales team if you have any questions.

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 Receiving: 1-4 days.

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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
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 TNT EXPRESS
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 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of ISSI

- Integrated Silicon Solution, Inc. (ISSI), is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) communications, (iii) digital consumer, and (iv) industrial and medical. Their primary products are high speed and low power SRAM and low and medium density DRAM. The company also designs and markets NOR flash products and high performance analog and mixed signal integrated circuits. They target high-growth markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. They have been a committed long-term supplier of memory products, including lower density and smaller volume products, even through periods of tight manufacturing capacity.

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