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MWI451-17E9

EXSHINE Part Number:EX-MWI451-17E9
Manufacturer Part Number:MWI451-17E9
Manufacturer / Brand:IXYS Corporation
Brief Description:IGBT E9PACK
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:MWI451-17E9
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
MWI451-17E9
In stock: 24510 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order MWI451-17E9 online

US$ 0

Reference Marketing Price: N/A

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Voltage - Collector Emitter Breakdown (Max) -
Vce(on) (Max) @ Vge, Ic -
Supplier Device Package -
Series -
Power - Max -
Package / Case -
Operating Temperature -40°C ~ 125°C (TJ)
NTC Thermistor No
Mounting Type Chassis Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number MWI451-17E9
Input Capacitance (Cies) @ Vce -
Input -
IGBT Type -
Expanded Description IGBT Module Chassis Mount
Description IGBT E9PACK
Current - Collector Cutoff (Max) -
Current - Collector (Ic) (Max) -
Configuration -

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
 Receiving: 1-2 hours.

 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of IXYS

- IXYS Corporation offers a broad line of High Power Semiconductors, including low on-resistance Power MOSFETs, ultra fast switching IGBTs, Fast Recovery Diodes (FREDs), SCR and Diode Modules, Rectifier Bridges, and Power Interface ICs.

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