TH71112ENE-BAA-000-TR

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EXSHINE Part Number:	EX-TH71112ENE-BAA-000-TR
Manufacturer Part Number:	TH71112ENE-BAA-000-TR
Manufacturer / Brand:	Melexis
Brief Description:	IC RECEIVER DBL-CON 32-LQFP
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	TH71112
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

TH71112ENE-BAA-000-TR
In stock: 26928 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Description
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Packaging

Product Parameter

Voltage - Supply	2.3 V ~ 5.5 V
Supplier Device Package	32-LQFP (7x7)
Series	-
Sensitivity	-112dBm
Packaging	Tray
Package / Case	32-LQFP
Other Names	TH71112 TH71112.1/LQFP32 TH71112.2 TH71112ENE TH71112ENE-ND
Operating Temperature	-40°C ~ 85°C
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Modulation or Protocol	ASK, FSK
Memory Size	-
Manufacturer Part Number	TH71112ENE-BAA-000-TR
Frequency	750MHz ~ 990MHz
Features	RSSI Equipped
Expanded Description	- RF Receiver ASK, FSK 750MHz ~ 990MHz -112dBm 260 kbps PCB, Surface Mount 32-LQFP (7x7)
Description	IC RECEIVER DBL-CON 32-LQFP
Data Rate (Max)	260 kbps
Data Interface	PCB, Surface Mount
Current - Receiving	9.2mA
Applications	Alarm and Security Systems, RKE, TPMS
Antenna Connector	PCB, Surface Mount

Others

Other Names	TH71112 TH71112.1/LQFP32 TH71112.2 TH71112ENE TH71112ENE-ND
Standard Package	250

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	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of Melexis Technologies NV

- For over a decade, Melexis has been designing and manufacturing products for the automotive sector, for which it offers a multitude of sensor ICs, ASSPs and ASICs. Melexis devices reliably live up to the highest standards of quality required in a demanding automotive environment.
Melexis operates in business units each covering a product line. The corporate headquarters is located in Belgium. R&D centers are in Belgium, France, Germany, Switzerland, Bulgaria and Ukraine. Probe and test facilities are in Belgium, Germany, Switzerland and the US. Application Engineering is located mainly in the US, Germany and France. Corporate marketing & sales is in the US headquarters.

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