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Home > Products > Integrated Circuits (ICs) > Microcontrollers IC > ATSAMA5D21B-CU
ATSAMA5D21B-CU

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ATSAMA5D21B-CU

EXSHINE Part Number:EX-ATSAMA5D21B-CU
Manufacturer Part Number:ATSAMA5D21B-CU
Manufacturer / Brand:Microchip Technology
Brief Description:IC MCU 32BIT EXT MEM 196TFBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:ATSAMA5D2x Series
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
ATSAMA5D21B-CU
In stock: 71520 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order ATSAMA5D21B-CU online

US$ 7.28

Reference Marketing Price: US$ 7.28

Our Best Price: N/A (Email us)

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Multiples:1

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Product Parameter

Voltage - Supply (Vcc/Vdd) 1.1 V ~ 3.6 V
Supplier Device Package 196-TFBGA (11x11)
Speed 500MHz
Series SAMA5D2
RAM Size 128K x 8
Program Memory Type External Program Memory
Program Memory Size -
Peripherals DMA, I²S, LCD, POR, PWM, WDT
Packaging Tray
Package / Case 196-TFBGA, CSBGA
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 72
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Manufacturer Standard Lead Time 19 Weeks
Manufacturer Part Number ATSAMA5D21B-CU
Expanded Description ARM® Cortex®-A5 SAMA5D2 Microcontroller IC 32-Bit 500MHz External Program Memory 196-TFBGA (11x11)
EEPROM Size -
Description IC MCU 32BIT EXT MEM 196TFBGA
Data Converters A/D 5x12b
Core Size 32-Bit
Core Processor ARM® Cortex®-A5
Connectivity EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SDIO/SD, QSPI, SPI, SSC, UART/USART, USB

Others

Standard Package 176

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Distributor of Microchip Technology

- Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.

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