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APTM100DA40T1G

EXSHINE Part Number:EX-APTM100DA40T1G
Manufacturer Part Number:APTM100DA40T1G
Manufacturer / Brand:Microsemi
Brief Description:MOSFET N-CH 1000V 20A SP1
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:APTM100DA40T1G
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Weight:-
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Real Time Availability for
APTM100DA40T1G
In stock: 34284 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Product Parameter

Vgs(th) (Max) @ Id 5V @ 2.5mA
Technology MOSFET (Metal Oxide)
Supplier Device Package SP1
Series -
Rds On (Max) @ Id, Vgs 480 mOhm @ 16A, 10V
Power Dissipation (Max) 357W (Tc)
Packaging Bulk
Package / Case SP1
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Chassis Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number APTM100DA40T1G
Input Capacitance (Ciss) (Max) @ Vds 6800pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 260nC @ 10V
FET Type N-Channel
FET Feature -
Expanded Description N-Channel 1000V (1kV) 20A 357W (Tc) Chassis Mount SP1
Drain to Source Voltage (Vdss) 1000V (1kV)
Description MOSFET N-CH 1000V 20A SP1
Current - Continuous Drain (Id) @ 25°C 20A

Others

Standard Package 1

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Distributor of Microsemi Corporation

- Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.

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