LE57D111BTCT

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EXSHINE Part Number:	EX-LE57D111BTCT
Manufacturer Part Number:	LE57D111BTCT
Manufacturer / Brand:	Microsemi
Brief Description:	IC SLIC 2CH 50DB 44TQFP
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	Le5711
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

LE57D111BTCT
In stock: 52310 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Packaging

Product Parameter

Voltage - Supply	4.75 V ~ 5.25 V
Supplier Device Package	44-TQFP-EP (10x10)
Series	-
Power (Watts)	-
Packaging	Tape & Reel (TR)
Package / Case	44-TQFP Exposed Pad
Operating Temperature	-40°C ~ 85°C
Number of Circuits	2
Mounting Type	Surface Mount
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Manufacturer Standard Lead Time	12 Weeks
Manufacturer Part Number	LE57D111BTCT
Interface	-
Includes	-
Function	Subscriber Line Interface Concept (SLIC)
Expanded Description	Telecom IC Subscriber Line Interface Concept (SLIC) 44-TQFP-EP (10x10)
Description	IC SLIC 2CH 50DB 44TQFP
Current - Supply	9mA

Others

Standard Package	1,500

You can choose the below payment options. Please contact our sales team if you have any questions.

	T/T (Bank Transfer) Receiving: 1-4 days.
	Paypal Receiving: immediately.
	Western Union Receiving: 1-2 hours.
	MoneyGram Receiving: 1-2 hours.
	Alipay Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.

If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of Microsemi Corporation

- Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.

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