M306N5FCGP#U3

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M306N5FCGP#U3

EXSHINE Part Number:EX-M306N5FCGP#U3
Manufacturer Part Number:M306N5FCGP#U3
Manufacturer / Brand:Renesas Electronics America
Brief Description:IC MCU 16BIT 128KB FLASH 100QFP
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:M16C/6N DatasheetM16C/6N Hardware Manual
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
M306N5FCGP#U3
In stock: 58240 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order M306N5FCGP#U3 online

US$ 19.941

Reference Marketing Price: US$ 19.941

Our Best Price: N/A (Email us)

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Multiples:1

90+:
$19.941
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Product Parameter

Voltage - Supply (Vcc/Vdd) 3 V ~ 5.5 V
Supplier Device Package 100-LFQFP (14x14)
Speed 24MHz
Series M16C™ M16C/60/6N5
RAM Size 5K x 8
Program Memory Type FLASH
Program Memory Size 128KB (128K x 8)
Peripherals DMA, WDT
Packaging Tray
Package / Case 100-LQFP
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 87
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Manufacturer Standard Lead Time 24 Weeks
Manufacturer Part Number M306N5FCGP#U3
Expanded Description M16C/60 M16C™ M16C/60/6N5 Microcontroller IC 16-Bit 24MHz 128KB (128K x 8) FLASH 100-LFQFP (14x14)
EEPROM Size -
Description IC MCU 16BIT 128KB FLASH 100QFP
Data Converters A/D 26x10b; D/A 2x8b
Core Size 16-Bit
Core Processor M16C/60
Connectivity CAN, I²C, IEBus, SIO, UART/USART

Others

Standard Package 90

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Distributor of Renesas Electronics America

- Renesas Electronics America designs and manufactures highly integrated semiconductor system solutions for automotive, mobile and PC/AV markets. Established on April 1, 2003, as a joint venture between Hitachi, Ltd. and Mitsubishi Electric Corporation and headquartered in Tokyo, Japan, Renesas is one of the largest semiconductor companies in the world and the world-leading microcontroller supplier globally. Besides microcontrollers, Renesas offers system-on-chip devices, smart card ICs, mixed-signal products, flash memories, SRAMs and more.

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