STFW3N170

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STFW3N170

EXSHINE Part Number:EX-STFW3N170
Manufacturer Part Number:STFW3N170
Manufacturer / Brand:STMicroelectronics
Brief Description:MOSFET N-CH 1700V 2.6A
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:STFW3N170
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
STFW3N170
In stock: 44060 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 4.52

Reference Marketing Price: US$ 4.52

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$4.52
10+:
$4.061
100+:
$3.327
500+:
$2.832
1000+:
$2.389
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Product Parameter

Vgs(th) (Max) @ Id 5V @ 250µA
Vgs (Max) ±30V
Technology MOSFET (Metal Oxide)
Supplier Device Package TO-3PF
Series PowerMESH™
Rds On (Max) @ Id, Vgs 13 Ohm @ 1.3A, 10V
Power Dissipation (Max) 63W (Tc)
Packaging Tube
Package / Case TO-3P-3 Full Pack
Other Names 497-16308-5
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Through Hole
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 18 Weeks
Manufacturer Part Number STFW3N170
Input Capacitance (Ciss) (Max) @ Vds 1100pF @ 100V
Gate Charge (Qg) (Max) @ Vgs 44nC @ 10V
FET Type N-Channel
FET Feature -
Expanded Description N-Channel 1700V (1.7kV) 2.6A (Tc) 63W (Tc) Through Hole TO-3PF
Drive Voltage (Max Rds On, Min Rds On) 10V
Drain to Source Voltage (Vdss) 1700V (1.7kV)
Description MOSFET N-CH 1700V 2.6A
Current - Continuous Drain (Id) @ 25°C 2.6A (Tc)

Others

Other Names 497-16308-5
Standard Package 30

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Distributor of STMicroelectronics

- STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.

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