STGB15M65DF2

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STGB15M65DF2

EXSHINE Part Number:EX-STGB15M65DF2
Manufacturer Part Number:STGB15M65DF2
Manufacturer / Brand:STMicroelectronics
Brief Description:TRENCH GATE FIELD-STOP IGBT M SE
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:1
Datasheet Download:STGB15M65DF2 Datasheet
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Weight:-
Alternative Replacement:-
Real Time Availability for
STGB15M65DF2
In stock: 45095000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order STGB15M65DF2 online

US$ 1.114

Reference Marketing Price: US$ 1.114

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1000+:
$1.114
2000+:
$1.038
5000+:
$0.999
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Product Parameter

Voltage - Collector Emitter Breakdown (Max) 650V
Vce(on) (Max) @ Vge, Ic 2V @ 15V, 15A
Test Condition 400V, 15A, 12 Ohm, 15V
Td (on/off) @ 25°C 24ns/93ns
Switching Energy 90µJ (on), 450µJ (off)
Supplier Device Package D2PAK
Series -
Reverse Recovery Time (trr) 142ns
Power - Max 136W
Packaging Tape & Reel (TR)
Package / Case TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Other Names 497-16507-2
Operating Temperature -55°C ~ 175°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 20 Weeks
Manufacturer Part Number STGB15M65DF2
Input Type Standard
IGBT Type Trench Field Stop
Gate Charge 45nC
Expanded Description IGBT Trench Field Stop 650V 30A 136W Surface Mount D2PAK
Description TRENCH GATE FIELD-STOP IGBT M SE
Current - Collector Pulsed (Icm) 60A
Current - Collector (Ic) (Max) 30A

Others

Standard Package 1,000
Other Names 497-16507-2

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- STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.

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