STGB20V60F

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STGB20V60F

EXSHINE Part Number:EX-STGB20V60F
Manufacturer Part Number:STGB20V60F
Manufacturer / Brand:STMicroelectronics
Brief Description:IGBT 600V 40A 167W D2PAK
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:STGx20V60F
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
STGB20V60F
In stock: 97180 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order STGB20V60F online

US$ 3.3

Reference Marketing Price: US$ 3.3

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$3.30
10+:
$2.96
100+:
$2.425
500+:
$2.065
  • Description
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Product Parameter

Voltage - Collector Emitter Breakdown (Max) 600V
Vce(on) (Max) @ Vge, Ic 2.2V @ 15V, 20A
Test Condition 400V, 20A, 15V
Td (on/off) @ 25°C 38ns/149ns
Switching Energy 200µJ (on), 130µJ (off)
Supplier Device Package D2PAK
Series -
Power - Max 167W
Packaging Original-Reel®
Package / Case TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Other Names 497-14977-6
Operating Temperature -55°C ~ 175°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Part Number STGB20V60F
Input Type Standard
IGBT Type Trench Field Stop
Gate Charge 116nC
Expanded Description IGBT Trench Field Stop 600V 40A 167W Surface Mount D2PAK
Description IGBT 600V 40A 167W D2PAK
Current - Collector Pulsed (Icm) 80A
Current - Collector (Ic) (Max) 40A

Others

Standard Package 1
Other Names 497-14977-6

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Distributor of STMicroelectronics

- STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.

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