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GRF1-J-P-04-E-RA-TH1

EXSHINE Part Number:EX-GRF1-J-P-04-E-RA-TH1
Manufacturer Part Number:GRF1-J-P-04-E-RA-TH1
Manufacturer / Brand:Samtec, Inc.
Brief Description:CONN MMCX JACK R/A 50 OHM PCB
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:GRF1-J-P-04-E-RA-TH1
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
GRF1-J-P-04-E-RA-TH1
In stock: 39810 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order GRF1-J-P-04-E-RA-TH1 online

US$ 19.43

Reference Marketing Price: US$ 19.43

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Product Parameter

Voltage Rating -
Shield Termination Solder
Series GRF1-J
Packaging -
Operating Temperature -40°C ~ 90°C
Mounting Type Through Hole, Right Angle
Mounting Feature -
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Mating Cycles -
Manufacturer Standard Lead Time 3 Weeks
Manufacturer Part Number GRF1-J-P-04-E-RA-TH1
Insertion Loss -
Ingress Protection -
Includes -
Impedance 50 Ohm
Housing Color Gold
Frequency - Max 6GHz
Features 4 Positions
Fastening Type Snap-On
Expanded Description MMCX Connector Jack, Female Socket 50 Ohm Through Hole, Right Angle Solder
Dielectric Material Polytetrafluoroethylene (PTFE)
Description CONN MMCX JACK R/A 50 OHM PCB
Contact Termination Solder
Connector Type Jack, Female Socket
Connector Style MMCX
Center Contact Plating Gold
Center Contact Material Beryllium Copper
Cable Group -
Body Material Brass
Body Finish Gold

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

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 Receiving: 1-4 days.

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If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

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 Delivery time: 1-3 days.
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 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.

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