MEC2-20-01-L-DV-K-TR

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EXSHINE Part Number:	EX-MEC2-20-01-L-DV-K-TR
Manufacturer Part Number:	MEC2-20-01-L-DV-K-TR
Manufacturer / Brand:	Samtec, Inc.
Brief Description:	MEC2 2.0MM EDGE CARD ASSEMBLY
Lead Free Status / RoHS Status:	Lead free / RoHS Compliant
Condition:	New and unused, Original
Datasheet Download:	MEC2-20-01-L-DV-K-TR
Application:	-
Weight:	-
Alternative Replacement:	-

Real Time Availability for

MEC2-20-01-L-DV-K-TR
In stock: 24370 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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Packaging

Product Parameter

Termination	Solder
Series	MEC2 - DV
Read Out	Dual
Pitch	0.079" (2.00mm)
Packaging	Tape & Reel (TR)
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Number of Positions/Bay/Row	20
Number of Positions	40
Mounting Type	Surface Mount
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Material - Insulation	Liquid Crystal Polymer (LCP)
Manufacturer Standard Lead Time	3 Weeks
Manufacturer Part Number	MEC2-20-01-L-DV-K-TR
Gender	Female
Flange Feature	-
Features	Board Guide
Description	MEC2 2.0MM EDGE CARD ASSEMBLY
Contact Type	-
Contact Material	Beryllium Copper
Contact Finish Thickness	10µin (0.25µm)
Contact Finish	Gold
Color	Black
Card Type	Non Specified - Dual Edge
Card Thickness	0.062" (1.57mm)

Others

Standard Package	250

You can choose the below payment options. Please contact our sales team if you have any questions.

	T/T (Bank Transfer) Receiving: 1-4 days.
	Paypal Receiving: immediately.
	Western Union Receiving: 1-2 hours.
	MoneyGram Receiving: 1-2 hours.
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You can choose the below shipping options, contact our sales team to check the shipping cost to your address.

If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

	DHL EXPRESS Delivery time: 1-3 days.
	FEDEX EXPRESS Delivery time: 1-3 days.
	UPS EXPRESS Delivery time: 2-4 days.
	TNT EXPRESS Delivery time: 3-6 days.
	EMS EXPRESS Delivery time: 7-10 days.

Distributor of Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.

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