SLW-137-01-G-D

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SLW-137-01-G-D

EXSHINE Part Number:EX-SLW-137-01-G-D
Manufacturer Part Number:SLW-137-01-G-D
Manufacturer / Brand:Samtec, Inc.
Brief Description:CONN RCPT .100" 74POS DUAL GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:SLW Series DrawingSLW (Double Row) FootprintSLW, CES Series Datasheet
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
SLW-137-01-G-D
In stock: 95550 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order SLW-137-01-G-D online

US$ 12.07

Reference Marketing Price: US$ 12.07

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

1+:
$12.07
10+:
$10.796
100+:
$8.891
500+:
$7.028
1000+:
$6.033
5000+:
$5.504
10000+:
$5.292
  • Description
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Product Parameter

Voltage Rating -
Termination Solder
Style Board to Board
Series SLW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Packaging Bulk
Other Names SAM1088-37
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 74
Mounting Type Through Hole
Material Flammability Rating -
Mated Stacking Heights 6.09mm
Manufacturer Part Number SLW-137-01-G-D
Insulation Material Polyester, Glass Filled
Insulation Height 0.180" (4.57mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Expanded Description 74 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold
Description CONN RCPT .100" 74POS DUAL GOLD
Current Rating -
Contact Type Forked
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.115" (2.92mm)
Contact Finish Thickness - Post 3µin (0.08µm)
Contact Finish Thickness - Mating 20µin (0.51µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Receptacle
Applications -

Others

Standard Package 1
Other Names SAM1088-37

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Distributor of Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).
To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.
Samtec was founded in 1976, is privately held, and is ISO 9001 and TS 16949 certified with a 5-A1 Dun and Bradstreet rating, the highest available for a corporation this size. Samtec is recognized as the service leader in the connector industry.

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