317060009

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317060009

EXSHINE Part Number:EX-317060009
Manufacturer Part Number:317060009
Manufacturer / Brand:Seeed
Brief Description:LINKIT CONNECT 7681 MODULE SCALE
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:317060009
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
317060009
In stock: 60755 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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  • Description
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Product Parameter

Voltage - Supply -
Series -
Serial Interfaces UART
Sensitivity -
RF Family/Standard WiFi
Protocol 802.11b/g/n
Power - Output -
Packaging Bulk
Package / Case Module
Operating Temperature -10°C ~ 70°C
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Modulation -
Memory Size -
Manufacturer Part Number 317060009
Frequency 2.4GHz
Description LINKIT CONNECT 7681 MODULE SCALE
Data Rate -
Current - Transmitting -
Current - Receiving -
Antenna Type Integrated, Chip + IPEX

Others

Standard Package 1

You can choose the below payment options. Please contact our sales team if you have any questions.

 T/T (Bank Transfer)
 Receiving: 1-4 days.

 Paypal
 Receiving: immediately.

 Western Union
 Receiving: 1-2 hours.

 MoneyGram
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 Alipay
 Receiving: immediately.

You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.

 DHL EXPRESS
 Delivery time: 1-3 days.
 FEDEX EXPRESS
 Delivery time: 1-3 days.
 UPS EXPRESS
 Delivery time: 2-4 days.
 TNT EXPRESS
 Delivery time: 3-6 days.
 EMS EXPRESS
 Delivery time: 7-10 days.


Distributor of Seeed Technology Co., Ltd

- Seeed is a hardware innovation platform for makers to grow inspirations into differentiating products. By working closely with technology providers of all scale, Seeed provides accessible technologies with quality, speed and supply chain knowledge. Diversified demands cannot be fully satisfied by mass production. The booming of open source hardware, 3D printing, crowd-funding and global logistics creates a evolutional easy platform to hardware innovators. Products are becoming democratized, as some of the consumers now calling themselves makers.

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