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HAY-22-8873CSCNG6PR6
| EXSHINE Part Number: | EX-HAY-22-8873CSCNG6PR6 |
|---|---|
| Manufacturer Part Number: | HAY-22-8873CSCNG6PR6 |
| Manufacturer / Brand: | Toshiba Semiconductor and Storage |
| Brief Description: | HAY-22-8873CSCNG6PR6 TOSHIBA DIP-64 new date code and low price |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Condition: | New and unused, Original |
| Datasheet Download: | HAY-22-8873CSCNG6PR6 |
| Application: | - |
| Weight: | - |
| Alternative Replacement: | - |
Real Time Availability for
HAY-22-8873CSCNG6PR6
In stock: 91836 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
In stock: 91836 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks
- Description
- Payment
- Shipping
- Packaging
Product Parameter
| Voltage | - |
|---|---|
| Series | HAY-22-8873CSC |
| Package Type | DIP-64 |
| Operating Temperature | - |
| Mounting Type | - |
| Moisture Sensitivity Level (MSL) | 1 |
| MFG Part Code | HAY-22-8873CSCNG6PR6 |
| Features | - |
| Dimension | - |
| Delivery Time | 1 Day |
| Date Code | New |
You can choose the below payment options. Please contact our sales team if you have any questions.
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|
T/T (Bank Transfer) Receiving: 1-4 days. |
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Paypal Receiving: immediately. |
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Western Union Receiving: 1-2 hours. |
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MoneyGram Receiving: 1-2 hours. |
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Alipay Receiving: immediately. |
You can choose the below shipping options, contact our sales team to check the shipping cost to your address.
If you don't want to use our shipping service, you can also arrange pick up from our warehouse or ship by your courier account.
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DHL EXPRESS Delivery time: 1-3 days. |
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FEDEX EXPRESS Delivery time: 1-3 days. |
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UPS EXPRESS Delivery time: 2-4 days. |
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TNT EXPRESS Delivery time: 3-6 days. |
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EMS EXPRESS Delivery time: 7-10 days. |
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Distributor of TOSHIBA
- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.
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