HN1B04FE-GR,LF

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HN1B04FE-GR,LF

EXSHINE Part Number:EX-HN1B04FE-GR,LF
Manufacturer Part Number:HN1B04FE-GR,LF
Manufacturer / Brand:Toshiba Semiconductor and Storage
Brief Description:TRANS NPN/PNP 50V 0.15A ES6
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:HN1B04FE
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
HN1B04FE-GR,LF
In stock: 59075000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

Click below to order HN1B04FE-GR,LF online

US$ 0.037

Reference Marketing Price: US$ 0.037

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

4000+:
$0.037
8000+:
$0.033
12000+:
$0.028
28000+:
$0.026
65535+:
$0.021
  • Description
  • Payment
  • Shipping
  • Packaging

Product Parameter

Voltage - Collector Emitter Breakdown (Max) 50V
Vce Saturation (Max) @ Ib, Ic 250mV @ 10mA, 100mA
Transistor Type NPN, PNP
Supplier Device Package ES6
Series -
Power - Max 100mW
Packaging Tape & Reel (TR)
Package / Case SOT-563, SOT-666
Other Names HN1B04FE-GR(5L,F,T
HN1B04FE-GR(5LFTTR
HN1B04FE-GR(5LFTTR-ND
HN1B04FE-GR,LF(B
HN1B04FE-GR,LF(T
HN1B04FE-GRLF(TTR
HN1B04FE-GRLF(TTR-ND
HN1B04FE-GRLFTR
HN1B04FEGRLFTR
HN1B04FEGRLFTR-ND
Operating Temperature 150°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 16 Weeks
Manufacturer Part Number HN1B04FE-GR,LF
Frequency - Transition 80MHz
Expanded Description Bipolar (BJT) Transistor Array NPN, PNP 50V 150mA 80MHz 100mW Surface Mount ES6
Description TRANS NPN/PNP 50V 0.15A ES6
DC Current Gain (hFE) (Min) @ Ic, Vce 200 @ 2mA, 6V
Current - Collector Cutoff (Max) 100nA (ICBO)
Current - Collector (Ic) (Max) 150mA

Others

Standard Package 4,000
Other Names HN1B04FE-GR(5L,F,T

HN1B04FE-GR(5LFTTR

HN1B04FE-GR(5LFTTR-ND

HN1B04FE-GR,LF(B

HN1B04FE-GR,LF(T

HN1B04FE-GRLF(TTR

HN1B04FE-GRLF(TTR-ND

HN1B04FE-GRLFTR

HN1B04FEGRLFTR

HN1B04FEGRLFTR-ND

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- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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