RN2910FE,LF(CB

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RN2910FE,LF(CB

EXSHINE Part Number:EX-RN2910FE,LF(CB
Manufacturer Part Number:RN2910FE,LF(CB
Manufacturer / Brand:Toshiba Semiconductor and Storage
Brief Description:TRANS 2PNP PREBIAS 0.1W ES6
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Condition:New and unused, Original
Datasheet Download:RN2910FE-11FE
Application:-
Weight:-
Alternative Replacement:-
Real Time Availability for
RN2910FE,LF(CB
In stock: 54003000 pcs can ship in 1-2 days.
Future Stock: 12000 pcs in 7-10 days.
Manufacturer Lead time: 8-10 Weeks

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US$ 0.027

Reference Marketing Price: US$ 0.027

Our Best Price: N/A (Email us)

Minimum:1

Multiples:1

4000+:
$0.027
8000+:
$0.024
12000+:
$0.021
28000+:
$0.019
65535+:
$0.014
  • Description
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Product Parameter

Voltage - Collector Emitter Breakdown (Max) 50V
Vce Saturation (Max) @ Ib, Ic 300mV @ 250µA, 5mA
Transistor Type 2 PNP - Pre-Biased (Dual)
Supplier Device Package ES6
Series -
Resistor - Emitter Base (R2) (Ohms) -
Resistor - Base (R1) (Ohms) 4.7k
Power - Max 100mW
Packaging Tape & Reel (TR)
Package / Case SOT-563, SOT-666
Other Names RN2910FE(T5L,F,T)
RN2910FE(T5LFT)TR
RN2910FE(T5LFT)TR-ND
RN2910FE,LF(CT
RN2910FELF(CBTR
RN2910FELF(CTTR
RN2910FELF(CTTR-ND
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 16 Weeks
Manufacturer Part Number RN2910FE,LF(CB
Frequency - Transition 200MHz
Expanded Description Pre-Biased Bipolar Transistor (BJT) 2 PNP - Pre-Biased (Dual) 50V 100mA 200MHz 100mW Surface Mount ES6
Description TRANS 2PNP PREBIAS 0.1W ES6
DC Current Gain (hFE) (Min) @ Ic, Vce 120 @ 1mA, 5V
Current - Collector Cutoff (Max) 100nA (ICBO)
Current - Collector (Ic) (Max) 100mA

Others

Standard Package 4,000
Other Names RN2910FE(T5L,F,T)

RN2910FE(T5LFT)TR

RN2910FE(T5LFT)TR-ND

RN2910FE,LF(CT

RN2910FELF(CBTR

RN2910FELF(CTTR

RN2910FELF(CTTR-ND

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Distributor of Toshiba Semiconductor and Storage

- Toshiba Semiconductor & Storage offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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